Thin Film Receiver Materials for Deterministic Assembly by Transfer Printing

Kim, T.I., Kim, M.J., Jung, Y.H., Jang, H., Dagdeviren, C., Pao, H.A., Cho, S.J., Carlson, A., Yu, K.J., Ameen, A., Chung, H.-j., Jin, S.H., Ma, Z., Rogers, J.A., Chemistry of Materials, 26(11), 3502–3507, 2014. [Cover Image]


We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelec- tronics, and other areas of interest.

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